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TSP900(Sil-Pad 400)
Futures & Benefits:
● Thermal Conductivity:0.9 W/m-K
● Thickness:0.178mm/0.229mm/0.279mm
● Continuous Use Temp.:-60℃ ~180℃
● Dielectric Breakdown Voltage (Vac.):3500-4500V
● Excellent mechanical and physical characteristics
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Product details