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Sil-Pad 2000
Futures & Benefits
● Thermal Conductivity:3.5 W/m-K
● Thickness:0.254mm/0.381mm/0.508mm
● Continuous Use Temp.:-60℃ ~200℃
● Dielectric Breakdown Voltage (Vac.):4000V
● Maximize the thermal and dielectric performance of the filler
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Product details