TSP1100ST(Sil-Pad 1100ST)
Futures & Benefits
● Thermal Conductivity:1.1 W/m-K
● Thickness:0.305mm
● Continuous Use Temp.:-60℃ ~180℃
● Dielectric Breakdown Voltage (Vac.):5000V
● Lined on both sides for ease of handling prior to placement in high volume assemblies
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